JPH0193773U - - Google Patents
Info
- Publication number
- JPH0193773U JPH0193773U JP18891087U JP18891087U JPH0193773U JP H0193773 U JPH0193773 U JP H0193773U JP 18891087 U JP18891087 U JP 18891087U JP 18891087 U JP18891087 U JP 18891087U JP H0193773 U JPH0193773 U JP H0193773U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- component mounting
- displayed
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000007547 defect Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18891087U JPH0193773U (en]) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18891087U JPH0193773U (en]) | 1987-12-14 | 1987-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0193773U true JPH0193773U (en]) | 1989-06-20 |
Family
ID=31479974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18891087U Pending JPH0193773U (en]) | 1987-12-14 | 1987-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0193773U (en]) |
-
1987
- 1987-12-14 JP JP18891087U patent/JPH0193773U/ja active Pending